 |
|
|
BARCs즯Ea href="../CMP/index.html">CMP즯Ea href="../Developers/index.html">developer즯Ea href="index.html">photoresist즯Ea href="../StrippersThinners/index.html">strippers
|
 |
|
|
| |
Photoresists are chemicals
used in creating circuit patterns on chips. Our photoresists range
from its conventional g-line and i-line used in mainstream devices
to advanced i-line, deep UV and 193 nm.
|
| |
Photoresist of semiconductor
|
| |
|
| No |
Product Name |
Characteristic |
Performance |
Thk
( ) |
Eop
(msec) |
Resolution
() |
| |
|
|
|
180 |
|
| 1 |
DSAM-300 |
g-line
Normal Grade |
1.23 |
|
0.6 |
| |
|
|
|
0.8 |
|
| |
|
g＆i-line Compatible High |
|
|
|
| |
|
|
|
128 |
|
| 2 |
DPR-i5500 |
Sensitivity Ractangular |
1.17 |
|
0.4 |
| |
|
|
|
0.6 |
|
| |
|
Profile |
|
|
|
| |
|
High Sensitivity |
|
132 |
|
| 3 |
DS-i1000 |
|
1.7 |
|
0.6 |
| |
|
Ractangular Profile |
|
0.8 |
|
| |
|
|
|
534 |
|
| 4 |
DPR-i7000 |
High Resolution & Contrast |
1.0 |
|
0.28 |
| |
|
|
|
|
0.34 |
| |
|
High Resolution＆Contras |
|
352 |
|
| 5 |
DPR-KT061 |
|
1.4 |
|
0.28 |
| |
|
Wide Process Margin |
|
0.35 |
|
| |
|
High Resolution＆Contrast |
|
175 |
|
| 6 |
DPR-i7148 |
|
1.18 |
|
0.28 |
| |
|
Wide Process Margin |
|
0.35 |
|
| |
|
High Resolution＆Contrast |
|
436 |
|
| 7 |
DPR-i7201 |
|
1.8 |
|
0.35 |
| |
|
Multi Purpose(L/S＆C/H)
|
|
0.50 |
|
|
| |
Photoresist for LCD process
|
| |
|
| Product Name |
Characteristics |
| DTFR-2000 |
Normal Grade |
| DTFR-3750B |
High Photo Speed ＆ High Retention |
| DTFR-710HP |
For 4-Mask Process ＆ Wide Process Margin |
| DTFR-5022 series |
For Large Size Glass ＆ High Adhesion |
| DTFR-6000 series |
Ultra High Speed, Retention ＆ No Mura |
| DTFR-BK100 |
Use the Same Developer with C/R
(KOH 0.04% Sol'n) |
| DTFR-EL100 |
For OLED |
| DTFR-320R |
For Roll Coater |
|
| |
Negative Photoresist for Lift-off ＆OLED Process
|
| |
|
| |
DNR-L300 |
DNR-H100PL |
DNR-1030 |
| Viscosity |
22～120 |
220 |
30 |
Film Thickness( ) |
2～10 |
4～12 |
2～5 |
| Thermal Properties(℃) |
＜ 120 |
＜ 150 |
＜ 250 |
| Reverse Taper Angel (°) |
75 |
75 |
65 |
|
| |
We offer a full line of deep-UV photoresists for isolated lines, contact holes, dense lines, and trenches. Following is an overview of our products:
|
| |
|
|
|
| 1.DHX-LX1000Series |
| |
DHK-LX1000 series are high resolution ＆ high yield KrF positive type photoresists that corresponds to photofabrication (esp. critical layer) greater than 1G DRAM. |
| |
|
Characteristics
- High Resolution
- Superior Defocus Properties
- Wide Process Margin
- High Contrast Properties
- Good Etch Resistance
|
|
| |
|
|
|
| 2.DHK-MX1000Series |
| |
DHK-MX1000 series are thick KrF positive type photoresists that correspond to photofabrication (esp. metal ＆ implant layer) ranging from 64M DRAM to1G DRAM. |
| |
|
Characteristics
- High Aspect Ratio
- Wide Process Margin
- Low ISO-dense Bias
- Rectangular Profile |
|
| |
|
|
|
| 3.DHK-CX1100Series |
| |
DHK-CX1100 series are KrF positive type photoresists that correspond to
photofabrication (esp. contact layer) ranging from 256M to 1G DRAM. |
| |
|
Characteristics
- High Contrast
- Steep Profile
- Wide Process Margin
- Superior Depth of Focus |
|
| |
|
|
|
| 4.DHA-GX20 |
| |
DHA-GX20 is a high resolution ArF positive type photoresist that corresponds to photofabrication (esp. Isolate layer) of high speed logic and high resolution memory. |
| |
|
Characteristics
- High Resolution
- Wide Process Margin
- High Etch Selectivity
- Low Line Edge Roughness |
|
| |
|
|
|
| 3.DHA-H150 |
| |
DHA-H150 is a high resolution ArF positive type photoresist that corresponds
to photofabrication (esp. Critical Dense L/S layer) ranging from 1G DRAM to 4G DRAM. |
| |
|
Characteristics
- High Resolution
- Wide Process Margin
- High Etch Selectivity |
|
SEMICONDUCTOR TOP
|
